MediaTek (News - Alert) announced a new 3D suite of solutions called “Cool 3D” that works on its MT6575 single-core and suiteMT6577 dual-core smartphones platforms. The suite includes support for stereo 3D cameras and displays, real-time 2D-to-3D conversion and a 3D user interface. Two other unique features are “3D cool shot” and “3D Cool Show.”
3D Cool Shot solution supports a 5-megapixel, dual lens camera, 1880p video and 24 frames per second 3D images. The 3D Cool Show features improve the stereo 3D effect with anti-fatigue capabilities, and real-time transformation between 2D/3D modes, allowing for convenient switching between the 2D and 3D displays. Both of these features are currently available on HTC (News - Alert) Evo 3D and LG Opitmus 3D smartphones.
"One consequence of the rapid developments in the smartphone market is product homogenization or the 'all smartphones look alike' phenomena. Creating product differentiation has become one of the biggest challenges for the mobile phone industry "said Ching-Jiang Hsieh, president of MediaTek. “From Dual-SIM to 3D capabilities, MediaTek has always pushed technological innovation in our platforms, enabling rich and compelling devices and solutions. By working together with our customers, we hope our industry-leading, ‘Cool 3D’ suite of solutions can lead the wave of 3D smartphone popularity, allowing even more consumers to enjoy an extraordinary 3D experience."
Smartphone image courtesy of Shutterstock.
MediaTek is a fabless semiconductor company for wireless communications, which supplies chipsets to low cost mobile phone companies, such as Spice, Micromax and Lava. MediaTek was founded in 1977 and is headquartered in Taiwan. It is a leader in cutting-edge SOC system solutions for wireless communications, high-definition TV, optical storage and DVD and Blu-ray products.
With the advances in mobile technology and mobile consumers always looking for new features that include 3D capabilities for games, movies and videos, we are likely to see other semiconductor companies offering 3D or HD capabilities in their chipsets in the near future.
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Edited by Rachel Ramsey