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December 05, 2012

Broadcom Unveils its Newest Smartphone Platform Optimized for Android 4.2 Jelly Bean OS


Broadcom Corporation has released its newest smartphone platform optimized for the Android (News - Alert) 4.2 Jelly Bean operating system (OS). The 3G platform, delivers strong performance capabilities at faster data speeds, is powered by the BCM21664T 1.2GHz HSPA+ cellular baseband. The BCM21664T and its turnkey design features the industry's first dual-core HSPA+ processor for affordable smartphones and integrates Broadcom's (News - Alert) leading connectivity suite, previously available only on higher-end Android devices.

The new BCM21664T platform combines the processing power of a dual core ARM (News - Alert) Cortex A9 with increased graphics and imaging capabilities to enhance the Android 4.2 experience. The chip is supported by radio frequency (RF), a power management unit (PMU) and an advanced connectivity suite for a complete system solution. The new platform is currently sampling with volume production expected early in Q2/2013.

Jeff Orr, practice director, Devices and Applications at ABI Research (News - Alert), said, “The expanding Android ecosystem combined with the complete platform approach championed by semiconductor manufacturers like Broadcom has helped put affordable, high-performing smartphones within reach of an even larger pool of consumers. By adding an advanced processor with HSPA+ enabled technology to its portfolio of 3G smartphone platforms, Broadcom will deliver an improved Android Jelly Bean experience that allows users to share and connect in meaningful ways.”

Rafael Sotomayor, vice president, Mobile Platform Solutions, stated, “As the first dual-core, HSPA+ enabled platform for entry-level Android smartphones, BCM21664T provides not only a better mobile experience at faster download speeds, but also establishes a new standard in performance for the growing base of low-cost smartphones. Mainstream consumers will continue to seek affordable smartphones and the user experience expectations of these devices will continue to grow. Broadcom's new chipset platform will help handset manufacturers deliver this enhanced functionality at new price points and capitalize on the expansion of the mobile Internet.”

Key Features:

  • 21.1 Mbps of downstream connectivity, 5.8 Mbps of upstream connectivity;
  • Graphics features of 720p HD recording and full 1080p playback supported by over 20GFLOPS of graphics processing capacity;
  • Miracast enabled for HD playback over wireless;
  • Industry leading, lowest power 3G/2G dual SIM-dual standby to enable global markets and
  • Complete reference design including schematics, tools, software and carrier specific features.

Recently, Broadcom introduced three new turnkey solutions that enable OEMs to expedite production of 3G smartphones while lowering development costs. For more news, visit Broadcom's Newsroom. The new platforms are powered by HSPA and HSPA+ processors that have been proven on multiple carrier networks globally and include popular hardware components and software applications that have been tested and accepted by regional operator requirements. By refining the platforms to account for device variations and pre-qualifying hardware component vendors, Broadcom offers multiple customization options and reduces the time to market. This allows handset manufacturers to focus on developing value-added features and affordably deliver a quality Android experience, across multiple smartphone product tiers, in approximately three months or less.

Want to learn more about the latest in communications and technology? Then be sure to attend ITEXPO Miami 2013, Jan 29- Feb. 1 in Miami, Florida.  Stay in touch with everything happening at ITEXPO (News - Alert). Follow us on Twitter.




Edited by Rich Steeves
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